IP Library Assignment 022627/0927
Patent Assignment
Reel/Frame 022627/0927

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2009-05-01 Received: 2009-05-01 Pages: 5
Assignors
CHI, HEEJO
Executed: 2009-04-28
CHO, NAMJU
Executed: 2009-04-28
SHIN, HANGIL
Executed: 2009-04-28
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SHIELDING LAYER AFTER ENCAPSULATION AND GROUNDED THROUGH INTERCONNECT STRUCTURE
App. No. 12/434,367