IP Library › Assignment 022674/0726
Patent Assignment
Reel/Frame 022674/0726

Assignment of Assignor's Interest

Recorded: 2009-05-13 Pages: 6
Assignors
CHOU, CHIU-MING
Executed: 2005-10-25
CHOU, CHIEN-KANG
Executed: 2005-10-25
LIN, CHING-SAN
Executed: 2005-10-25
LIN, MOU-SHIUNG
Executed: 2005-10-25
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD.,, HSINCHU, 300, TAIWAN
Covered Property (1)
Semiconductor Chip with Passivation Layer Comprising Metal Interconnect and Contact Pads
Patent: 8,242,601 →
Application: 12/464,896 →
Publication: US 2009/0218687
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →