Assignment of Assignor's Interest

Recorded: 2009-05-14 Received: 2009-05-14 Pages: 4

Assignor

LEE, WON-HO

Executed: 2009-05-14

Assignee

HYNIX SEMICONDUCTOR, INC.

SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI, KYOUNGKI-DO, KRX, KOREA, REPUBLIC OF

Covered Properties (2)

Diimine Complexes for Olefin Polymerization

Application: 10/087,028 →

Image Sensor Forming Method Capable of Defining Connection Window Structure by Etching Field Oxide

Application: 09/941,256 →