Patent Assignment
Reel/Frame 022717/0362
Assignment of Assignor's Interest
Recorded: 2009-05-21
Pages: 3
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Microelectronic Package Containing Silicon Patches for High Density Interconnects, and Method of Manufacturing Same