IP Library Assignment 022726/0226
Patent Assignment
Reel/Frame 022726/0226

Assignment of Assignor's Interest

Recorded: 2009-05-22 Pages: 4
Assignors
SATO, AKIHIRO
Executed: 2009-04-27
SASAKI, MASAHIRO
Executed: 2009-04-27
OHMI, TADAHIRO
Executed: 2009-04-27
MORIMOTO, AKIHIRO
Executed: 2009-04-27
Assignees
DAISHO DENSHI CO., LTD.
2-16-5, DENEN-CHOFU, OTA-KU, TOKYO 145-0071, JAPAN
TOHOKU UNIVERSITY
1-1, KATAHIRA 2-CHOME, AOBA-KU, SENDAI-SHI, MIYAGI 980-8577, JAPAN
Covered Property (1)
Flex-Rigid Printed Wiring Board and Manufacturing Method Thereof
Patent: 8,188,372 →
Application: 12/442,016 →
Publication: US 2010/0051325