Patent Assignment
Reel/Frame 022735/0701
Assignment of Assignor's Interest
Recorded: 2009-05-26
Pages: 3
Assignor
FJELSTAD, JOSEPH C., MR.
Executed: 2009-05-26
Assignee
INTERCONNECT PORTFOLIO LLC
20400 STEVENS CREEK BLVD., 5TH FLOOR, I. P. LEGAL, CUPERTINO, CALIFORNIA, 95014
Covered Property
(1)
Method and Apparatus for Vertical Stacking of Integrated Circuit Chips
Application:
12/464,253 →
Publication:
US 2010/0289130
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 7, 2010
From: TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0596 →
Assignment of Assignor's Interest
Oct 7, 2010
From: INTERCONNECT PORTFOLIO, LLC; INTELLASYS BEC LIMITED; TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0634 →