Patent Assignment
Reel/Frame 022736/0180
Assignment of Assignor's Interest
Recorded: 2009-05-26
Pages: 3
Assignors
SASAKI, YOSHITAKA
Executed: 2009-04-08
ITO, HIROYUKI
Executed: 2009-04-08
IIJIMA, ATSUSHI
Executed: 2009-04-29
Assignees
HEADWAY TECHNOLOGIES, INC.
678 S. HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
SAE MAGNETICS (H.K.) LTD.
SAE TECHNOLOGY CENTER, 6 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK, SHATIN, N.T., HONG KONG
Covered Property
(1)
Semiconductor Substrate, Laminated Chip Package, Semiconductor Plate and Method of Manufacturing the Same