Patent Assignment
Reel/Frame 022742/0478
Merger
Recorded: 2009-05-27
Received: 2009-05-27
Pages: 77
Assignor
HYUNDAI MICRO ELECTRONICS CO., LTD.
Executed: 1999-10-14
Assignee
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI, KYOUNGKI-DO, GEX, GEORGIA
Covered Properties
(4)
Charge Coupled Device and Method of Fabricating the Same
Application:
10/086,520 →
Solid State Image Sensor and Method for Fabricating the Same
Application:
09/879,887 →
Solid State Ccd Image Sensor Having a Light Shielding Layer
Application:
09/879,061 →
Solid State Image Sensor Device and Method of Fabricating the Same
Application:
09/809,284 →