Patent Assignment
Reel/Frame 022797/0162
Assignment of Assignor's Interest
Recorded: 2009-06-08
Pages: 4
Assignors
HSIEH, JUI-CHING
Executed: 2009-05-25
CHANG, PIN
Executed: 2009-05-25
CHEN, CHUNG-DE
Executed: 2009-05-25
PAN, LI-CHI
Executed: 2009-05-04
WANG, YU-JEN
Executed: 2009-05-25
WANG, CHIN-HORNG
Executed: 2009-05-05
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG, HSINCHU, 31040, TAIWAN
Covered Property
(1)
Chip Package Structure and Method of Fabricating the Same