IP Library › Assignment 022821/0286
Patent Assignment
Reel/Frame 022821/0286

Assignment of Assignor's Interest

Recorded: 2009-06-09 Pages: 3
Assignors
KUDOSE, SATORU
Executed: 2009-05-29
NAKAGAWA, TOMOKATSU
Executed: 2009-05-29
KATOH, TATSUYA
Executed: 2009-05-29
Assignee
SHARP KABUSHIKI KAISHA
22-22 NAGAIKE-CHO ABENO-KU, OSAKA-SHI, OSAKA, 545-8522, JAPAN
Covered Property (1)
Ic Chip Mounting Package Provided with Ic Chip Located in Device Hole Formed Within a Package Base Member
Patent: 8,193,627 →
Application: 12/448,106 →
Publication: US 2009/0273071
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 11, 2020
From: SHARP KABUSHIKI KAISHA
To: SHENZHEN TOREY MICROELECTRONIC TECHNOLOGY CO. LTD.
Reel/Frame 053754/0905 →