Patent Assignment
Reel/Frame 022883/0414
Assignment of Assignor's Interest
Recorded: 2009-06-23
Pages: 2
Assignor
MOROZUMI, AKIRA
Executed: 2009-06-04
Assignee
FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
11-2 OSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, 141-0032, JAPAN
Covered Property
(1)
Semiconductor device with insulating substrate joined to heat radiator
Application:
12/453,453 →
Publication:
US 2009/0289344
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 20, 2010
From: FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
To: FUJI ELECTRIC SYSTEMS CO., LTD.
Reel/Frame 024252/0438 →
Merger and Change of Name
Aug 26, 2011
From: FUJI ELECTRIC SYSTEMS CO., LTD. (FES); FUJI TECHNOSURVEY CO., LTD. (MERGER BY ABSORPTION)
To: FUJI ELECTRIC CO., LTD.
Reel/Frame 026970/0872 →