IP Library Assignment 022884/0135
Patent Assignment
Reel/Frame 022884/0135

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2009-06-26 Received: 2009-06-26 Pages: 5
Assignors
LEE, YONGTAEK
Executed: 2009-06-25
PADMANATHAN, MEENAKSHI
Executed: 2009-06-25
YOON, SEUNG UK
Executed: 2009-06-25
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
Semiconductor Device and Method of Forming Inductor Over Insulating Material Filled Trench In Substrate
App. No. 12/493,049