Assignment of Assignor's Interest

Recorded: 2009-07-08 Received: 2009-07-08 Pages: 4

Assignor

INNOCOMM TECHNOLOGY LIMITED

Executed: 2009-05-25

Assignee

EUTREND TECHNOLOGY, INC.

1F, NO. 1, PROSPERITY ROAD 1, SCIENCE PARK, HSINCHU, TAIWAN 30078, REPUBLIC OF CHINA, TWX, TAIWAN

Covered Properties (3)

Multi-Layer Interconnect Module and Method of Interconnection

Application: 10/061,546 →

Temperature Compensated Current Mirror

Application: 09/976,445 →

Mmic Power Amplifier with Wirebond Output Matching Circuit

Application: 09/765,996 →