IP Library › Assignment 022925/0918
Patent Assignment
Reel/Frame 022925/0918

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2009-07-08 Received: 2009-07-08 Pages: 5
Assignors
CHUA, LINDA PEI EE
Executed: 2009-06-12
DO, BYUNG TAI
Executed: 2009-06-12
PAGAILA, REZA ARGENTY
Executed: 2009-06-12
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THROUGH VIA DIE HAVING PEDESTAL AND RECESS AND METHOD OF MANUFACTURE THEREOF
App. No. 12/486,271
→