Patent Assignment
Reel/Frame 022926/0238
Assignment of Assignor's Interest
Recorded: 2009-07-08
Pages: 2
Assignors
HARADA, TAKESHI
Executed: 2009-04-23
SHIBATA, JUNICHI
Executed: 2009-04-23
UEKI, AKIRA
Executed: 2009-04-23
Assignee
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Semiconductor Device Including Interconnects, Vias Connecting the Interconnects and Greater Thickness of the Liner Film Adjacent the Vias
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.