IP Library Assignment 022931/0379
Patent Assignment
Reel/Frame 022931/0379

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2009-07-08 Received: 2009-07-08 Pages: 5
Assignors
DO, BYUNG TAI
Executed: 2009-06-17
PAGAILA, REZA ARGENTY
Executed: 2009-06-17
HA, JONG-WOO
Executed: 2009-06-18
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INWARD AND OUTWARD INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF
App. No. 12/488,089