Patent Assignment
Reel/Frame 022934/0800
Assignment of Assignor's Interest
Recorded: 2009-07-09
Pages: 3
Assignee
ALPHANA TECHNOLOGY CO., LTD.
430-1, HANAGURA, FUJIEDA-SHI, SHIZUOKA, 426-0292, JAPAN
Covered Property
(1)
Adhesion Structure and Method Using Electrically Conductive Adhesive, Disk Drive Device Using the Adhesion Structure and Method, and Method for Manufacturing the Disk Drive Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.