Assignment of Assignor's Interest

Recorded: 2009-07-08 Pages: 3

Assignors

KUDOSE, SATORU

Executed: 2009-05-25

NAKAGAWA, TOMOKATSU

Executed: 2009-05-25

KATOH, TATSUYA

Executed: 2009-05-25

Assignee

SHARP KABUSHIKI KAISHA

22-22 NAGAIKE-CHO ABENO-KU, OSAKA-SHI, OSAKA, 545-8522, JAPAN

Covered Property (1)

Ic Chip Package Employing Substrate with a Device Hole

Patent: 8,129,825 →

Application: 12/312,981 →

Publication: US 2010/0019394

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.