Assignment Agreement

Recorded: 2009-07-17 Received: 2009-07-17 Pages: 5

Assignor

HESTIA TECHNOLOGIES, INC.

Executed: 2008-12-30

Assignee

INTERCONNECT SYSTEMS, INC.

759 FLYNN ROAD, CAMARILLO, CA, 93012, UNITED STATES

Covered Properties (5)

Light-Emitting Pixel Array Package And Method of Manufacturing The Same

Application: 12/174,518 →

Use of Hashed Content Addressable Memory (Cam) to Accelerate Content-Aware Searches

Application: 10/173,206 →

Chip Package with Molded Underfill

Application: 09/967,676 →

Methods and Apparatus for Making Integrated Circuit Package Including Opening Exposing Portion of the Ic

Application: 09/931,587 →

Integrated Circuit Package Including Opening Exposing Portion of an Ic

Application: 09/931,378 →