Patent Assignment
Reel/Frame 023002/0008
Assignment of Assignor's Interest
Recorded: 2009-07-15
Pages: 2
Assignee
SAMSUNG MOBILE DISPLAY CO., LTD.
SAN #24 NONGSEO-DONG, GIHEUNG-GU, YONGIN-CITY, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Mother substrate cutting apparatus, method of cutting a mother substrate using the same and organic light emitting diode display cut thereby
Application:
12/458,527 →
Publication:
US 2010/0011925
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.