Patent Assignment
Reel/Frame 023028/0660
Assignment of Assignor's Interest
Recorded: 2009-07-30
Pages: 2
Assignors
KIM, DONG-GYU
Executed: 2009-07-10
KWON, YEONG-KEUN
Executed: 2009-07-10
LEE, JU-HEE
Executed: 2009-07-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI,, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Manufacturing Method for Contact Pads of a Thin Film Transistor Array Panel, and a Thin Film Transistor Array Panel Having Such Contact Pads
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.