Patent Assignment
Reel/Frame 023092/0137
Assignment of Assignor's Interest
Recorded: 2009-08-12
Received: 2009-08-12
Pages: 2
Assignors
HATA, HANAE
Executed: 2009-07-01
NAKAMURA, MASATO
Executed: 2009-07-01
KINOSHITA, NOBUHIRO
Executed: 2009-07-06
NAKANISHI, MASAKI
Executed: 2009-07-07
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTE-MACHI 2-CHOME, CHIYODA-KU, TOKYO, JPX, JAPAN
Covered Properties
(2)
Interposer Substrate, Lsi Chip and Information Terminal Device Using the Interposer Substrate, Manufacturing Method of Interposer Substrate, and Manufacturing Method of Lsi Chip
Application:
12/521,602 →
Systems and Methods for Monitoring Selected Terrestrially Used Satellite Frequency Signals to Reduce Potential Interference
Application:
12/540,142 →