IP Library › Assignment 023271/0040
Patent Assignment
Reel/Frame 023271/0040

Corrective Assignment to Correct the Assignor's Name Previously Recorded on Reel 022037 Frame 0766. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2009-09-23 Pages: 5
Assignors
HARAKAWA, TOSHIRO
Executed: 2008-12-15
SHIMIZU, TERUO
Executed: 2008-12-15
MARUYAMA, TSUNEO
Executed: 2008-12-15
Assignee
MITSUBISHI MATERIALS PMG CORPORATION
3-1-1, KOGANECHO, HIGASHI-KU, NIIGATA-SHI, NIIGATA-KEN, JAPAN
Covered Property (1)
Abrasion Resistant Sintered Copper Base Cu-Ni-Sn Alloy and Bearing Made from the Same
Application: 12/306,524 →
Publication: US 2009/0311129
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 30, 2008
From: HARAKAWA, TOSHIO; SHIMIZU, TERUO; MURAYAMA, TSUNEO
To: MITSUBISHI MATERIALS PMG CORPORATION
Reel/Frame 022037/0766 →
Change of Name Jan 19, 2010
From: MITSUBISHI MATERIALS PMG CORPORATION
To: DIAMET CORPORATION
Reel/Frame 023809/0725 →