Patent Assignment
Reel/Frame 023324/0230
Assignment of Assignor's Interest
Recorded: 2009-10-02
Pages: 4
Assignee
TDK CORPORATION
1-13-1, NIHONBASHI, CHUO-KU, TOKYO 103-8272, JAPAN
Covered Property
(1)
Semiconductor embedded module and method for producing the same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.