Patent Assignment
Reel/Frame 023401/0649
Assignment of Assignor's Interest
Recorded: 2009-10-21
Pages: 2
Assignor
PARK, SANG HOON
Executed: 1999-05-29
Assignee
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI, KYOUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Cmos Image Sensor Integrated Together with Memory Device
Related Assignments
(8)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 12, 2004
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 015238/0812 →
Assignment of Assignor's Interest
Jan 10, 2005
From: HYNIX SEMICONDUCTOR, INC.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 016216/0649 →
After-Acquired Intellectual Property Kun-Pledge Agreement
Feb 18, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 022277/0133 →
Assignment of Assignor's Interest
May 30, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: CROSSTEK CAPITAL, LLC
Reel/Frame 022764/0270 →
Partial Release of Security Interest
Aug 10, 2009
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 023075/0054 →
Merger
Jul 22, 2011
From: CROSSTEK CAPITAL, LLC
To: INTELLECTUAL VENTURES II LLC
Reel/Frame 026637/0632 →
Assignment of Assignor's Interest
Jan 20, 2018
From: INTELLECTUAL VENTURES II LLC
To: INTELLECTUAL VENTURES ASSETS 64 LLC
Reel/Frame 044682/0552 →
Assignment of Assignor's Interest
Mar 26, 2018
From: INTELLECTUAL VENTURES ASSETS 64 LLC
To: PHOTONIC IMAGING SOLUTIONS INC.
Reel/Frame 045351/0019 →