Patent Assignment
Reel/Frame 023406/0165
Assignment of Assignor's Interest
Recorded: 2009-10-22
Pages: 2
Assignors
RAI, RUTUNJ
Executed: 2009-10-06
HAMPO, RICHARD
Executed: 2009-10-08
MILLS, JOHN
Executed: 2009-10-08
Assignee
LEAR CORPORATION
21557 TELEGRAPH ROAD, SOUTHFIELD, MICHIGAN, 48033
Covered Property
(1)
System and Method for Reduced Thermal Resistance Between a Power Electronics Printed Circuit Board and a Base Plate
Application:
61/245,464 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Grant of First Lien Security Interest in Patent Rights
Nov 16, 2009
From: LEAR CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
Reel/Frame 023519/0267 →
Grant of Second Lien Security Interest in Patent Rights
Nov 16, 2009
From: LEAR CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT AND COLLATERAL AGENT
Reel/Frame 023519/0626 →
Release of Security Interest
Apr 25, 2014
From: JPMORGAN CHASE BANK, N.A.
To: LEAR CORPORATION
Reel/Frame 032770/0843 →
Release of Security Interest
Feb 4, 2016
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: LEAR CORPORATION
Reel/Frame 037701/0180 →
Release of Security Interest
Feb 4, 2016
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: LEAR CORPORATION
Reel/Frame 037701/0251 →
Release of Security Interest
Feb 4, 2016
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: LEAR CORPORATION
Reel/Frame 037701/0340 →