Patent Assignment
Reel/Frame 023472/0399
Assignment of Assignor's Interest
Recorded: 2009-11-04
Pages: 5
Assignee
INTERSIL AMERICAS, INC.
1001 MURPHY RANCH ROAD, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
Low Thermal Resistance and Robust Chip-Scale-Package (Csp), Structure and Method
Application:
12/612,616 →
Publication:
US 2010/0276701
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.