Patent Assignment
Reel/Frame 023609/0155
Assignment of Assignor's Interest
Recorded: 2009-12-04
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Three-Dimensional System-in-Package Architecture