Patent Assignment
Reel/Frame 023623/0838
Assignment of Assignor's Interest
Recorded: 2009-12-08
Pages: 4
Assignors
SHIN, SU-DONG
Executed: 2009-12-08
KIM, MYOUNG-JIN
Executed: 2009-12-08
HEO, JEONG-HUN
Executed: 2009-12-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Injection Mold and Injection Molding Method Using the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.