Patent Assignment
Reel/Frame 023628/0275
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded: 2009-12-09
Received: 2009-12-09
Pages: 2
Assignors
MISUMI, KAZUYUKI
Executed: 2009-09-18
AOKI, MITSURU
Executed: 2009-09-28
ARAKAWA, HIDEYUKI
Executed: 2009-09-28
YAMAUCHI, SHUNJI
Executed: 2009-10-01
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JPX, JAPAN
Covered Application
(1)
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND WIRE BONDER
App. No. 12/633,830
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