IP Library Assignment 023643/0232
Patent Assignment
Reel/Frame 023643/0232

Assignment of Assignor's Interest

Recorded: 2009-12-11 Pages: 2
Assignors
BONTHRON, ANDREW J.
Executed: 2009-12-07
WALWORTH, DARREN JAY
Executed: 2009-12-04
Assignee
SIERRA MONOLITHICS, INC.
103 W. TORRANCE BLVD., REDONDO BEACH, CALIFORNIA, 90277
Covered Property (1)
Chip Assembly with Chip-Scale Packaging
Patent: 8,093,714 →
Application: 12/635,677 →
Publication: US 2011/0140260
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 9, 2010
From: SIERRA MONOLITHICS, INC.
To: SEMTECH CORPORATION
Reel/Frame 024512/0414 →
Grant of Security Interest Mar 20, 2012
From: SEMTECH CORPORATION; SEMTECH NEW YORK CORPORATION; SIERRA MONOLITHICS, INC.
To: JEFFERIES FINANCE LLC
Reel/Frame 027897/0141 →
Release of Security Interest May 2, 2013
From: JEFFERIES FINANCE LLC
To: SEMTECH CORPORATION; SEMTECH NEW YORK CORPORATION; SIERRA MONOLITHICS, INC.
Reel/Frame 030341/0059 →
Security Agreement May 2, 2013
From: SEMTECH CORPORATION; SEMTECH NEW YORK CORPORATION; SIERRA MONOLITHICS, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 030341/0099 →
Security Interest Nov 17, 2016
From: SEMTECH CORPORATION; SEMTECH NEW YORK CORPORATION; SIERRA MONOLITHICS, INC.; SEMTECH EV, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 040646/0799 →
Assignment of Patent Security Interest Previously Recorded at Reel/Frame (040646/0799) Feb 17, 2023
From: HSBC BANK USA, NATIONAL ASSOCIATION, AS RESIGNING AGENT
To: JPMORGAN CHASE BANK, N.A., AS SUCCESSOR AGENT
Reel/Frame 062781/0544 →