IP Library › Assignment 023660/0330
Patent Assignment
Reel/Frame 023660/0330

Assignment of Assignor's Interest

Recorded: 2009-12-16 Pages: 3
Assignors
PENG, JENG-JIE
Executed: 1998-12-10
KER, MING-DOU
Executed: 1998-12-10
WANG, NIEN-MING
Executed: 1998-12-10
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG TOWN, HSINCHU HSIEN, TAIWAN
Covered Property (1)
Method for Improving Integrated Circuits Bonding Firmness
Patent: 6,599,578 →
Application: 10/224,360 →
Publication: US 2002/0197458
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 3, 2006
From: INDUSTRIAL TECHNOLOGY RESERACH INSTITUTE
To: TRANSPACIFIC IP LTD.
Reel/Frame 018498/0272 →