IP Library › Assignment 023687/0584
Patent Assignment
Reel/Frame 023687/0584

Assignment of Assignor's Interest

Recorded: 2009-12-22 Pages: 2
Assignors
TOBA, TAKEO
Executed: 2009-10-01
TANAKA, KAZUO
Executed: 2009-10-01
ISHIZUKA, HIROYASU
Executed: 2009-10-07
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Integrated Circuit Package Having a Pad Lead Part Which Is Coupled to an I/O Pad and Lies Between a Logic Block and a Transistor.
Application: 12/642,760 →
Publication: US 2010/0155845
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 13, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024864/0635 →
Merger Aug 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024879/0190 →