Patent Assignment
Reel/Frame 023702/0504
Assignment of Assignor's Interest
Recorded: 2009-12-23
Pages: 3
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Rearrangement sheet, semiconductor device and method of manufacturing thereof
Application:
12/153,501 →
Publication:
US 2009/0031563