Patent Assignment
Reel/Frame 023702/0730
Assignment of Assignor's Interest
Recorded: 2009-12-10
Pages: 2
Assignors
FUJII, TETSUO
Executed: 2009-11-19
YAMANAKA, AKITOSHI
Executed: 2009-12-01
YOKURA, HISANORI
Executed: 2009-11-23
Assignee
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA-CITY, AICHI-PREF., 448-8661, JAPAN
Covered Property
(1)
Semiconductor Device and Method for Manufacturing the Same