Patent Assignment
Reel/Frame 023829/0320
Assignment of Assignor's Interest
Recorded: 2010-01-21
Pages: 2
Assignor
WALWORTH, DARREN JAY
Executed: 2010-01-20
Assignee
SEMTECH CORPORATION
200 FLYNN ROAD, CAMARILLO, CALIFORNIA, 93012
Covered Property
(1)
Multi-Layer High-Speed Integrated Circuit Ball Grid Array Package and Process
Patent:
8,487,430 →
Application:
12/691,675 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jul 21, 2015
From: SEMTECH CORPORATION
To: HSBC BANK USA, NATIONAL ASSOCIATION
Reel/Frame 036146/0366 →
Security Interest
Nov 17, 2016
From: SEMTECH CORPORATION; SEMTECH NEW YORK CORPORATION; SIERRA MONOLITHICS, INC.; SEMTECH EV, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 040646/0799 →
Assignment of Patent Security Interest Previously Recorded at Reel/Frame (040646/0799)
Feb 17, 2023
From: HSBC BANK USA, NATIONAL ASSOCIATION, AS RESIGNING AGENT
To: JPMORGAN CHASE BANK, N.A., AS SUCCESSOR AGENT
Reel/Frame 062781/0544 →