Patent Assignment
Reel/Frame 023916/0628
Assignment of Assignor's Interest
Recorded: 2010-02-09
Pages: 4
Assignors
LAI, YI-JEN
Executed: 2010-01-19
HAN, CHIH-KANG
Executed: 2010-01-19
CHAN, CHIEN-PIN
Executed: 2010-01-21
CHIEN, CHIH-YUAN
Executed: 2010-01-19
YANG, HUAI-TEI
Executed: 2010-01-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device and Semiconductor Assembly with Lead-Free Solder