Assignment of Assignor's Interest

Recorded: 2010-02-09 Pages: 5

Assignor

Executed: 2006-11-22

Assignee

UNIT LEVEL 13 MAIN OFFICER TOWER, FINANCIAL PARK LABUAN JALAN, MERDEKA, LABUAN, 87000, MALAYSIA

Covered Property (1)

Method for fabricating low leakage interconnect layers in integrated circuits

Application: 11/525,428 →

Publication: US 2007/0020920

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.