Patent Assignment
Reel/Frame 023959/0210
Assignment of Assignor's Interest
Recorded: 2010-02-18
Pages: 2
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Ball-Grid-Array Package, Electronic System and Method of Manufacture