Patent Assignment
Reel/Frame 024002/0577
Assignment of Assignor's Interest
Recorded: 2010-02-26
Pages: 5
Assignors
LIN, CHARLES W.C.
Executed: 2010-02-22
WANG, CHIA-CHUNG
Executed: 2010-02-22
LIM, SANGWHOO
Executed: 2010-02-24
Assignee
BRIDGE SEMICONDUCTOR CORPORATION
3RD FLOOR, 157 LI-TE ROAD, PEITOU DISTRICT, TAIPEI, 112, TAIWAN
Covered Property
(1)
Semiconductor Chip Assembly with Post/Base Heat Spreader and Cavity Over Post
Application:
12/714,417 →
Publication:
US 2010/0181594