Patent Assignment
Reel/Frame 024007/0650
Assignment of Assignor's Interest
Recorded: 2010-03-01
Pages: 5
Assignors
SWEENEY, FIFIN
Executed: 2010-02-18
SHAH, MILIND P.
Executed: 2010-02-23
VELEZ, MARIO FRANCISCO
Executed: 2010-02-18
GASTELUM, DAMION B.
Executed: 2010-02-18
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, PATENT DEPARTMENT, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property
(1)
Thermal Vias in an Integrated Circuit Package with an Embedded Die