Assignment of Assignor's Interest

Recorded: 2010-03-04 Pages: 4

Assignor

HECK, HENRY G.

Executed: 2007-09-28

Assignee

DOW GLOBAL TECHNOLOGIES INC.

2040 DOW CENTER, MIDLAND, MICHIGAN, 48674

Covered Property (1)

Filled Tpo Compositions with Good Low Temperature Ductility

Patent: 8,283,399 →

Application: 12/676,422 →

Publication: US 2010/0204381

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.