Patent Assignment
Reel/Frame 024030/0094
Assignment of Assignor's Interest
Recorded: 2010-03-04
Pages: 2
Assignors
WU, WENG-JIN
Executed: 2010-02-25
YANG, KU-FENG
Executed: 2010-02-25
CHIOU, WEN-CHIH
Executed: 2010-02-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Handling a Thin Wafer