Patent Assignment
Reel/Frame 024031/0603
Assignment of Assignor's Interest
Recorded: 2010-03-04
Pages: 4
Assignors
LEE, SANG YOUP
Executed: 2009-12-11
RYU, JOUNG GUL
Executed: 2009-12-11
KIM, DONG SUN
Executed: 2009-12-11
CHOI, JAE HOON
Executed: 2009-12-11
SEO, IN HO
Executed: 2009-12-11
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Heat Dissipating Substrate and Method of Manufacturing the Same