Assignment of Assignor's Interest

Recorded: 2010-03-05 Pages: 4

Assignors

BOND, ROBERT H.

Executed: 2010-03-04

KRAMER, ALAN

Executed: 2010-03-04

GOZZINI, GIOVANNI

Executed: 2010-03-04

Assignee

UPEK, INC.

5900 CHRISTIE AVE., EMERYVILLE, CALIFORNIA, 94608

Covered Property (1)

Integrally Molded Die and Bezel Structure for Fingerprint Sensors and the Like

Patent: 8,378,508 →

Application: 12/718,880 →

Publication: US 2011/0215484

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.