IP Library Assignment 024061/0144
Patent Assignment
Reel/Frame 024061/0144

ASSIGNMENT OF ASSIGNOR'S INTEREST

Recorded: 2010-03-10 Received: 2010-03-10 Pages: 5
Assignors
CHI, HEEJO
Executed: 2010-03-05
CHO, NAMJU
Executed: 2010-03-05
SHIN, HANGIL
Executed: 2010-03-05
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, SGX, 569059, SINGAPORE
Covered Application (1)
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF
App. No. 12/718,939