Patent Assignment
Reel/Frame 024066/0781
Assignment of Assignor's Interest
Recorded: 2010-03-12
Received: 2010-03-12
Pages: 3
Assignor
MITSUBISHI DENKI KABUSHIKI KAISHA
Executed: 2010-03-04
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JPX, 100-0004, JAPAN
Covered Properties
(2)
Microfluidic Device
Application:
10/599,525 →
Resin-Sealed Chip Stack Type Semiconductor Device
Application:
09/781,237 →