IP Library › Assignment 024073/0341
Patent Assignment
Reel/Frame 024073/0341

Assignment of Assignor's Interest

Recorded: 2010-03-12 Pages: 4
Assignors
LIN, MOU-SHIUNG
Executed: 2010-03-09
LEE, JIN-YUAN
Executed: 2010-03-09
LO, HSIN-JUNG
Executed: 2010-03-09
YANG, PING-JUNG
Executed: 2010-03-09
LIU, TE-SHENG
Executed: 2010-03-09
Assignee
MEGICA CORPORATION
8F.-1, NO. 29, PUDING ROAD, EAST DISTRICT, HSIN-CHU, 30072, TAIWAN
Covered Property (1)
Integrated Circuit Chip Using Top Post-Passivation Technology and Bottom Structure Technology
Patent: 8,456,856 →
Application: 12/722,483 →
Publication: US 2010/0246152
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →