Patent Assignment
Reel/Frame 024087/0713
Assignment of Assignor's Interest
Recorded: 2010-03-16
Pages: 2
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer-Level Lens Module and Image Pickup Device Including the Same