IP Library › Assignment 024091/0633
Patent Assignment
Reel/Frame 024091/0633

Assignment of Assignor's Interest

Recorded: 2010-03-18 Received: 2010-03-18 Pages: 6
Assignor
HITACHI, LTD.
Executed: 2010-03-03
Assignee
RENESAS TECHNOLOGY CORP.
6-2, OTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JPX, 100-0004, JAPAN
Covered Properties (14)
Semiconductor Integrated Circuit Device Having Power Reduction Mechanism
Application: 10/704,849 →
Data Processing System and Image Processing System
Application: 10/216,179 →
Semiconductor Device Including Multi-Chip
Application: 10/140,945 →
Semiconductor Integrated Circuit Device
Application: 10/109,669 →
Method of Fabricating Semiconductor Device
Application: 10/106,364 →
Semiconductor Integrated Circuit Device Having Power Reduction Mechanism
Application: 10/051,013 →
Semiconductor Integrated Circuit Device
Application: 09/987,820 →
Semiconductor Device
Application: 09/970,668 →
Method of Fabricating Semiconductor Device
Application: 09/957,041 →
Semiconductor Device Including Multi-Chip
Application: 09/897,503 →
Data Processing System and Image Processing System
Application: 09/879,045 →
Method of Forming a Cmos Structure Having Gate Insulation Films of Different Thicknesses
Application: 09/852,793 →
Semiconductor Device Including Multi-Chip
Application: 09/803,958 →
Semiconductor integrated circuit device having power reduction mechanism
Application: 09/766,979 →